JPS6186938U - - Google Patents

Info

Publication number
JPS6186938U
JPS6186938U JP17144784U JP17144784U JPS6186938U JP S6186938 U JPS6186938 U JP S6186938U JP 17144784 U JP17144784 U JP 17144784U JP 17144784 U JP17144784 U JP 17144784U JP S6186938 U JPS6186938 U JP S6186938U
Authority
JP
Japan
Prior art keywords
transfer passage
mold
molds
sliding member
resin material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17144784U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0238447Y2 (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984171447U priority Critical patent/JPH0238447Y2/ja
Priority to US06/796,814 priority patent/US4723899A/en
Publication of JPS6186938U publication Critical patent/JPS6186938U/ja
Application granted granted Critical
Publication of JPH0238447Y2 publication Critical patent/JPH0238447Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1984171447U 1984-11-12 1984-11-12 Expired JPH0238447Y2 (en])

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1984171447U JPH0238447Y2 (en]) 1984-11-12 1984-11-12
US06/796,814 US4723899A (en) 1984-11-12 1985-11-12 Molding apparatus for enclosing semiconductor chips with resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984171447U JPH0238447Y2 (en]) 1984-11-12 1984-11-12

Publications (2)

Publication Number Publication Date
JPS6186938U true JPS6186938U (en]) 1986-06-07
JPH0238447Y2 JPH0238447Y2 (en]) 1990-10-17

Family

ID=30729134

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984171447U Expired JPH0238447Y2 (en]) 1984-11-12 1984-11-12

Country Status (1)

Country Link
JP (1) JPH0238447Y2 (en])

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS592326A (ja) * 1982-06-28 1984-01-07 Toshiba Corp 半導体素子の樹脂成形方法およびその装置
JPS5959428A (ja) * 1982-09-30 1984-04-05 Toshiba Corp 樹脂モ−ルド封止装置
JPS59149027A (ja) * 1983-02-16 1984-08-25 Hitachi Ltd モ−ルド装置
JPS60149423A (ja) * 1984-01-13 1985-08-06 Matsushita Electric Works Ltd 封止成形金型
JPS60214916A (ja) * 1984-04-10 1985-10-28 Matsushita Electric Works Ltd 封止成形金型の成形圧力調整機構

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS592326A (ja) * 1982-06-28 1984-01-07 Toshiba Corp 半導体素子の樹脂成形方法およびその装置
JPS5959428A (ja) * 1982-09-30 1984-04-05 Toshiba Corp 樹脂モ−ルド封止装置
JPS59149027A (ja) * 1983-02-16 1984-08-25 Hitachi Ltd モ−ルド装置
JPS60149423A (ja) * 1984-01-13 1985-08-06 Matsushita Electric Works Ltd 封止成形金型
JPS60214916A (ja) * 1984-04-10 1985-10-28 Matsushita Electric Works Ltd 封止成形金型の成形圧力調整機構

Also Published As

Publication number Publication date
JPH0238447Y2 (en]) 1990-10-17

Similar Documents

Publication Publication Date Title
JP2564707B2 (ja) 電子部品用リードフレームにおけるモールド部のマルチ式成形方法及び成形装置
JPS5886315U (ja) 半導体樹脂封入成形用金型装置
JPS5611236A (en) Method and metallic mold for plastic molding
JPS6186938U (en])
JPS5926244U (ja) 半導体樹脂封入成形用の成形装置
JPS62157143U (en])
JPS6262435U (en])
CN219213918U (zh) 一种硅胶耳帽成型治具
KR950000049Y1 (ko) 몰드다이
JPS646266Y2 (en])
JPS622247U (en])
JPH0258344A (ja) リードフレームに対するモールド部の成形装置
JPS6444732A (en) Preparation of seat body
JPS635227Y2 (en])
JPH0220334U (en])
JPH0329308U (en])
JPH0417349U (en])
JPH032639U (en])
JPH0320123U (en])
JPH01163111U (en])
JPS6388412U (en])
JPS63189616U (en])
JPH01161009U (en])
JPH01119321U (en])
JPS6380121U (en])